品玩6月28日讯，三星电子当地时间6月27日在美国加州硅谷举办“2023三星晶圆代工论坛”。三星电子晶圆代工业务部门社长崔时荣表示，客户公司正在积极开发人工智能专用芯片，三星电子将通过最优化于人工智能芯片的全环绕栅极（Gate All Around，简称GAA）晶体管技术创新，引领人工智能技术模式的变化。
与此同时，三星还决定从2025年起提供人工智能技术所需的高性能低电耗氮化镓（GaN）功率半导体晶圆代工服务。为此公司将同相关企业构建先进封装协商机制“MDI（Multi Die Integration）同盟”，领导新一代封装市场。三星电子介绍，将通过这些措施，公司力争在2027年将半导体生产能力提升至2021年的7.3倍。
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